S'inscrire | Se connecter | FAQ      [?] 

Journal of Adhesion Science and Technology

Articles from the last few issues of Journal of Adhesion Science and Technology © VSP, an imprint of Brill
  • Modeling of Adhesion for Railway Vehicles
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1017-1034.
    by Spiryagin, Maksym, Lee, Kwan Soo, Yoo, Hong Hee, Kashura, Oleksandr, Kostyukevich, Oleksandr
  • Polymer Functionalization and Thin Film Deposition by Remote Cold Nitrogen Plasma Process
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1035-1055.
    by Mutel, Brigitte
  • Application of a Genetic Algorithm Associated With Adhesive Joint Analysis to the IC Chip Pick-up Process
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1057-1072.
    by Cheng, Tung-Hua, Tseng, Ching-Huan, Hung, Ching-Hua
  • Impact of Lipopolysaccharide Extraction on Bacterial Adhesion and Transport
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1073-1088.
    by Penagonda, Vijay, Hilton, Amy Chan, Chen, Gang
  • The Influence of Chemical Pre-treatment and Magnesium Surface Enrichment on Bonding of Succinic Acid Molecules to Aluminium Alloy
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1089-1104.
    by De Wit, , Mol, , Terryn, , De Wit,
  • Modeling and Analysis of the Irradiance of Incipient Curing Light Reaching the AdhesiveWorkpiece Interface Within a LAAG Joint
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1105-1121.
    by Bakera, C Clinton, De Meterb, C Edward
  • A New Concept for Adhesion Promotion in MetalPolymer Systems by Introduction of Covalently Bonded Spacers at the Interface
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1123-1143.
    by Friedrich, , Mix, , Wettmarshausen,
  • Wetting Behavior of Aqueous Solutions of Binary Surfactant Mixtures to Poly(tetrafluoroethylene)
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1145-1157.
    by Szymczyk, Katarzyna, Janczuk, Bronislaw
  • Effect of Processing Conditions on Adhesion Performance of a SolGel Reinforced Epoxy/Aluminum Interface
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1159-1180.
    by Liu, Jiong, Chaudhury, K Manoj, Berry, H Douglas, Seebergh, E Jill, Osborne, H Joseph, Blohowiak, Y Kay
  • The Miscibility of Novel Bisphenol-Propylene Epoxy Resin With Liquid NBR
    Journal of Adhesion Science and Technology, Vol. 22, No. 10-11. (2008), pp. 1181-1196.
    by Zhang, Junying, Zhai, Yanyan, Kim, Hyun-Joong
  • On the work of adhesion and peel strength between pressure sensitive adhesives and the polymeric films used in LCD devices
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 903-915.
    by S Sohn, S Yang
  • Particle adhesion and removal in electrophotography
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 917-942.
    by DS Rimai, DS Weiss, DJ Quesnel
  • Stress analysis and strength estimation of butt adhesive joints of dissimilar hollow cylinders under impact tensile loadings
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 943-965.
    by T Sawa, Y Suzuki, S Kido
  • Indirect estimation of fiber/polymer bond strength and interfacial friction from maximum load values recorded in the microbond and pull-out tests. Part II: Critical energy release rate
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 967-980.
    by S Zhandarov, E Mader
  • Fatigue damage evaluation of adhesively bonded butt joints with a rubber-modified epoxy adhesive
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 981-994.
    by M Imanaka, T Hamano, A Morimoto, R Ashino, M Kimoto
  • Thermal non-linear elastic stress analysis of an adhesively bonded T-joint
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 995-1016.
    by MK Apalak, ZG Apalak, R Gunes
  • Adhesion characteristics of plasma surface treated carbon/epoxy composite
    Journal of Adhesion Science and Technology, Vol. 17, No. 7. (2003), pp. 1017-1037.
    by JK Kim, DG Lee
  • Editorial Note
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 795-795.
    by Mittal, Kash
  • Guest Editorial
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 797-799.
    by Gomatam, R Rajesh
  • An Overview of the Use of Electrically Conductive Adhesives (ECAs) as a Solder Replacement
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 801-813.
    by Lewis, , Coughlan,
  • Recent Advances in Nano-conductive Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 815-834.
    by Daniel Lu, Daoqiang, Grace Li, Yi, Wong,
  • Recent Advances in Developing High Performance Isotropic Conductive Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 835-851.
    by Daniel Lu, Daoqiang, Wong,
  • Electrically Conductive Adhesives for Electronic Packaging and Assembly Applications
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 853-869.
    by Matienzo, , Das, , Egitto,
  • Anisotropic Conductive Adhesives for Flip-Chip Interconnects
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 871-892.
    by Wang, Weiqiang, Chan, , Pecht, Michael
  • Using Electrically Conductive Inks and Adhesives as a Means to Satisfy European PCB Manufacturing Directives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 893-913.
    by Lewis, , Ryan,
  • Operating Temperature of Anisotropic Conducting Film Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 915-926.
    by Divigalpitiya, Ranjith
  • Fatigue Behavior of Electrically Conductive Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 927-946.
    by Su, Bin, Qu, Jianmin
  • Geometric Effects on Multilayer Generic Circuits Fabricated Using Conductive Epoxy/Nickel Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 947-956.
    by Zhou, Jianguo, Sancaktar, Erol
  • Chemorheology of Epoxy/Nickel Conductive Adhesives During Processing and Cure
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 957-981.
    by Zhou, Jianguo, Sancaktar, Erol
  • Stable and Unstable Capillary Flows of Highly-Filled Epoxy/Nickel Suspensions
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 983-1002.
    by Zhou, Jianguo, Sancaktar, Erol
  • Novel Techniques for Characterization of Fast-Cure Anisotropic Conductive and Non-conductive Adhesives
    Journal of Adhesion Science and Technology, Vol. 22, No. 8. (2008), pp. 1003-1015.
    by Teo, Mary
  • Editorial Note
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 403-403.
    by Mittal, Kash
  • Guest Editorial
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 405-406.
    by Cetinkaya, Cetin
  • Scaling of van der Waals and Electrostatic Adhesion Interactions from the Micro- to the Nano-Scale
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 407-428.
    by Kumar, Gautam, Smith, Shanna, Jaiswal, Ravi, Beaudoin, Stephen
  • Measurement and Modeling of Adhesion Energy Between Two Rough Microelectromechanical System (MEMS) Surfaces
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 429-455.
    by Xue, Xiaojie, Polycarpou, A Andreas, Phinney, M Leslie
  • Micro/Nano-particle Manipulation and Adhesion Studies
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 457-480.
    by Ding, Weiqiang
  • Rolling and Spinning Friction Characterization of Fine Particles Using Lateral Force Microscopy Based Contact Pushing
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 481-506.
    by Sumer, Bilsay, Sitti, Metin
  • Adhesion Characterization Based on Rolling Resistance of Individual Microspheres on Substrates: Review of Recent Experimental Progress
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 507-528.
    by Peri, MD Murthy, Cetinkaya, Cetin
  • The Effect of Surface-Adhering Nanoclusters on the Adhesion and Cohesion of Micrometer-Size Particles
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 529-543.
    by Rimai, , Dejesus, , Weiss,
  • Adhesion and Surface Issues in Cellulose and Nanocellulose
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 545-567.
    by Gardner, J Douglas, Oporto, S Gloria, Mills, Ryan, Samir, My
  • Adhesion of Biologically Inspired Oil-Coated Polymer Micropillars
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 569-589.
    by Cheung, Eugene, Sitti, Metin
  • Particle Detachment, Resuspension and Transport Due to Human Walking in Indoor Environments
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 591-621.
    by Zhang, Xinyu, Ahmadi, Goodarz, Qian, Jing, Ferro, Andrea
  • The Influence of Humidity on the Mechanisms Involved in Laser-Induced Particle Ejection Experiments
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 623-634.
    by Grojo, , Delaporte, , Sentis,
  • Numerical Simulation of Laser Shock Cleaning Process for Micro-Scale Particle Removal
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 635-650.
    by Oh, Bukuk, Lee, Jin-Won, Lee, Jong-Myoung, Kim, Dongsik
  • Removal of Nanoparticles With Laser Induced Plasma
    Journal of Adhesion Science and Technology, Vol. 22, No. 5. (2008), pp. 651-674.
    by Varghese, Ivin, Peri, MD Murthy, Dunbar, Thomas, Maynard, Brian, Thomas, A Derek, Cetinkaya, Cetin
  • Intentional Polymer Particle Contamination and the Simulation of Adhesion Failure due to Transit Scratches in Ultra-thin Solar Control Coatings on Glass
    Journal of Adhesion Science and Technology, Vol. 22, No. 2. (2008), pp. 121-132.
    by Belde, J Krishna, Bull,
  • Composite Resin-to-Metal Shear Bond Strengths Using Six Intra-oral Repair Systems
    Journal of Adhesion Science and Technology, Vol. 22, No. 2. (2008), pp. 133-146.
    by Pfeiffer, , Nergiz, , Selcuk, , Platzer, , Schmage,
  • UV-Ozone Surface Treatment of SBS Rubbers Containing Fillers: Influence of the Filler Nature on the Extent of Surface Modification and Adhesion
    Journal of Adhesion Science and Technology, Vol. 22, No. 2. (2008), pp. 147-168.
    by Romero-Sanchez, D Maria, Martin-Martinez, Jose Miguel
  • Wood Welded Connections: Energy Release Rate Measurement
    Journal of Adhesion Science and Technology, Vol. 22, No. 2. (2008), pp. 169-179.
    by Ganne-Chedeville, , Duchanois, , Pizzi, , Pichelin, , Properzi, , Leban,
  • Influence of Humidity on Adhesion: An Atomic Force Microscope Study
    Journal of Adhesion Science and Technology, Vol. 22, No. 2. (2008), pp. 181-203.
    by Farshchi-Tabrizia, Mahdi, Kappl, Michael, Butt, Hans-Jurgen
    • Remarque: pour citer cette page, utilisez l'url suivante: http://www.citeulike.org/journal/vsp-ast

    Result page: 1 2 3 4 5 6 7 Next RIS BibTeX
    CiteULike organises scholarly (or academic) papers or literature and provides bibliographic (which means it makes bibliographies) for universities and higher education establishments. It helps undergraduates and postgraduates. People studying for PhDs or in postdoctoral (postdoc) positions. The service is similar in scope to EndNote or RefWorks or any other reference manager like BibTeX, but it is a social bookmarking service for scientists and humanities researchers.